Vibrational and Thermal Analysis on a Printed Circuit Board

VIBRATIONAL AND THERMAL ANALYSIS ON A PRINTED CIRCUIT BOARD

G78 Mini Project

Submitted in partial fulfillment for the requirement of B.E. degree in Mechanical Engineering of Anna University        

Submitted by

N.VIGNESH

(13G104)

and

D.SHARATH SUBRAMANIAN

(13G83)

Guided by

Dr. V.BALASUBRAMANI

Asst. professor[pic 1]

Department of Mechanical Engineering

THIAGARAJAR COLLEGE OF ENGINEERING

(An Autonomous Institution Affiliated To Anna University)

MADURAI – 625 016

NOVEMBER 2016          

THIAGARAJAR COLLEGE OF ENGINEERING

(An Autonomous Institution Affiliated to Anna University)

MADURAI – 625 015.[pic 2]

CERTIFICATE

Certified  that  this  is  a  bonafide  record  of  the G84 Project Work  & Viva Voce done by  Mr.N.VIGNESH (13G104) and Mr.D.SHARATH SUBRAMANIAN  (13G83) of Seventh Semester B.E. (Mechanical Engineering) during the year 2016 - 2017.

Signature of the Guide                                                       Signature of H.D.M.E                                                             

Station: Madurai                                                                      Date:

Submitted for Viva-Voce examination held at Thiagarajar College of Engineering, Madurai – 625 015, on __________________.

INTERNAL EXAMINER                EXTERNAL EXAMINER                 H.D.M.E.    

CERTIFICATE

This is to certify that the G84 Project Work Report entitled “Vibrational and Thermal Analysis on a Printed Circuit Board”, being submitted by Mr. N.VIGNESH and Mr. D.SHARATH SUBRAMANIAN in partial fulfillment for the requirement of Bachelor of Engineering Degree in Mechanical Engineering, is a record of bonafide work. The results embodied in this report have not been submitted to any other university or institute for the award of any degree or diploma.

Mr. N.VIGNESH,                                               Dr. V.BALASUBRAMANI

Mr. D.SHARATH SUBRAMANIAN

  (B.E. STUDENT)                                                                        (GUIDE)

Station: Madurai                                                                      Date:

LIST OF CONTENTS

LIST OF FIGURES

LIST OF TABLES

ABSTRACT

The printed circuit board (PCB) subject to vibration and thermal loading is of great interest as Vibration and thermal loadings can lead to an operating mode violation of the electronic equipment, Printed Circuit Board (PCB) and electronic components failure. Since these boards are used in aircraft application they have to be designed as per MIL-STD-810F. This study mainly focusses on verification of the PCB to satisfy the specified standards. The soldering effect and vias are ignored considering input data complexity and a set of real PCB along with components and casing has been exposed to random vibration and peak temperature conditions. The major difficulty with PCB vibration response prediction is caused by influence of electronic components, as the components effectively increase the mass and stiffness of the PCB. This work developed a methodology of PCB vibration analysis using simplified finite element models. Electronic components are continuously getting smaller and embedding more and more powered functions which exacerbate the temperature rise in component board interconnect areas. For still air conditions, the heat spreading of the board is mainly done through the metallic planes. Their design optimization is henceforth mandatory to control the temperature and to preserve component reliability. To allow the electronic designer to early analyze the limits of the heat dissipation of miniaturized devices, a CAD model of a multi-layered electronic board was established then the thermal behavior comparison of a detailed multi-layer representation to its deducted compact model for an extensive set of variable parameters, such as heat transfer coefficients, effective thermal conductivities, number of trace layers, trace coverage. The results highlight the vibration response of the board with corresponding fixtures and the areas of maximum temperature distribution which enables the designer to optimize the complete module.

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